Flip chip technology has enabled electronics technology to reach new levels of performance, while fueling the growth of global markets for semiconductors, electronic devices, and a host of industrial and consumer products. Technological advances, shrinking chip size, improved thermal heat transfer, and increasing use in communication and other devices are expected to drive significant near-term growth in this market.
BCC Research provides an in-depth analysis of the global flip chip technology market through its report FlipChip Technologies and Global Markets. According to the report, this market was valued at $18.9 billion in 2012 and is estimated at $20.1 billion for 2013. BCC Research projects the market to grow to nearly $36.5 billion by 2018, and register a five-year compound annual growth rate of 12.7% from 2013 to 2018.
Use this report to:
- Gain an overview of the global market for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices to the external circuitry by means of a solder bumping process deposit on pads.
- Analyze global market trends, with data from 2012, estimates for 2013, and projections of CAGRs for the period, 2013 to 2018.
- Examine the evolution, architecture, and value chain of flip-chip technologies.
- Assess the flip-chip assembly market by geography, including North America, Europe, Asia-Pacific, and others.
- Evaluate coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
- Review comprehensive company profiles of major players in the industry.
To order your copy of this report (or any of its chapters) or to download the complimentary introduction chapter, click here.
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